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The first bump-bonded pixel detectors on CVD diamond

Abstract : Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98565544f the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectations given the detector pitch. (13 refs).
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http://hal.in2p3.fr/in2p3-00012128
Contributor : Magali Damoiseaux <>
Submitted on : Monday, May 29, 2000 - 1:34:03 PM
Last modification on : Monday, March 29, 2021 - 3:22:09 PM

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  • HAL Id : in2p3-00012128, version 1

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W. Adam, C. Bauer, E. Berdermann, P. Bergonzo, F. Bogani, et al.. The first bump-bonded pixel detectors on CVD diamond. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Elsevier, 1999, 436, pp.326-335. ⟨in2p3-00012128⟩

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