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OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project

Abstract : In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.
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http://hal.in2p3.fr/in2p3-00490042
Contributor : Sabine Starita <>
Submitted on : Monday, June 7, 2010 - 5:11:41 PM
Last modification on : Wednesday, September 16, 2020 - 4:24:28 PM
Long-term archiving on: : Friday, September 17, 2010 - 12:56:41 PM

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  • HAL Id : in2p3-00490042, version 1

Citation

A. Lounis, C. de la Taille, N. Seguin-Moreau, G. Martin-Chassard, D. Thienpont, et al.. OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project. Topical Workshop on Electronics for Particle Physics (TWEPP-09), Sep 2009, Paris, France. pp.443-447. ⟨in2p3-00490042⟩

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