Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip

Abstract : The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.
Type de document :
Article dans une revue
Journal of Instrumentation, IOP Publishing, 2012, 7, pp.P11010. <10.1088/1748-0221/7/11/P11010>


http://hal.in2p3.fr/in2p3-00730896
Contributeur : Emmanuelle Vernay <>
Soumis le : mardi 11 septembre 2012 - 13:33:50
Dernière modification le : mercredi 27 juillet 2016 - 14:48:48

Identifiants

Collections

Citation

J. Albert, J. Collot, D. Dzahini, L. Eraud, D. Grondin, et al.. Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip. Journal of Instrumentation, IOP Publishing, 2012, 7, pp.P11010. <10.1088/1748-0221/7/11/P11010>. <in2p3-00730896>

Exporter

Partager

Métriques

Consultations de la notice

157