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Test Results of the first 3D-IC Prototype Chip Developed in the Framework of HL-SLHC/ATLAS Hybrid Pixel Upgrade

Abstract : To face new challenges brought by the upgrades of the Large Hadron Collider at CERN and of ATLAS pixels detector, for which high spatial resolution, very good signal to noise ratio and high radiation hardness are needed, 3D Integrated Technologies are investigated. Commercial offers of such technologies are only very few and the 3D designer's choice is as a consequence strongly constrained. We present here the test results of the first 3D prototype chip developed in the GlobalFoundries 130 nm chips processed by the Tezzaron Company, submitted within the 3D-IC consortium for which a reliable qualification program was developed. Reliability and influence on the integrated devices behavior of Bond Interface (BI) and Through Silicon Via (TSV) connections, both needed for the 3D integration process, has also been addressed by the tests.
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http://hal.in2p3.fr/in2p3-00868843
Contributor : Danielle Cristofol <>
Submitted on : Wednesday, October 2, 2013 - 9:39:50 AM
Last modification on : Thursday, January 18, 2018 - 1:55:56 AM

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  • HAL Id : in2p3-00868843, version 1

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P. Pangaud, D. Arutinov, M. B. Barbero, F. Bompard, P. Breugnon, et al.. Test Results of the first 3D-IC Prototype Chip Developed in the Framework of HL-SLHC/ATLAS Hybrid Pixel Upgrade. TWEPP 2013 - Topical Workshop on Electronics for Particle Physics, Sep 2013, Perugia, Italy. ⟨in2p3-00868843⟩

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