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VIPS 2010 - Workshop on Vertically Integrated Pixel Sensors, Pavia : Italie (2010)
3D electronic for SLHC pixels
J.C. Clémens1

Future requirements of post-LHC vertex detectors are one step beyond the actual ones. Facing these new challenges could be addressed by 3D technologies which offer an alternative way of 2D shrinking with the advantages of technology mixing and cost effectiveness. Starting from the FE_I4 prototype design in IBM 130 nm designed for IBL, we developed 3D variants in Tezzaron-Chartered technology. These variants are made by face to face, copper bonding of 2 electronics wafers, the first one sheltering all analog functions, the second one dedicated to digital activity. Sensor is foreseen to be connected to read-out electronics by usual solder bumps. Design choices and test plans will be presen
1 :  CPPM - Centre de Physique des Particules de Marseille
Physique/Physique/Instrumentations et Détecteurs

Sciences de l'ingénieur/Electronique