During the shutdown 2013/14, for the enhancement of the current ATLAS Pixel Detector a fourth layer (Insertable B Layer, IBL) consisting of 14 staves is being built and will be installed between the innermost layer and a new beam pipe. A new read out chip generation has been developed and two different sensor designs, a rather conventional planar and a 3D design, have been flip chipped to these front ends. New staves and module flex circuits have been developed as well. Therefore, a production QA test bench has been established to test all production staves before integration with the new beam pipe. Quality assurance measurements under cleanroom conditions, including temperature and humidity control, are performed on the individual components during the various production steps of the IBL, namely connectivity as well as electrical tests and signal probing on individual parts and assembled subsystems. The pre-assembly QC procedures, the capabilities of the stave qualification setup, and recent results from stave testing are presented and discussed